Method of forming deposition films for use in multi-layer metallization
US4024041A · kind A · utility
14Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1975 |
| Grant date | May 17, 1977 |
| Priority date | — |
| Expiry date | Dec 16, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/143
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming thin films wherein a film is formed through glow discharge such as ion plating or sputtering by using a mask whose surface in contact with the surface of the substrate on which the film is formed is provided with a thermostable elastic member, whereby the film, for use in multi-layer metallization, can be formed with high dimensional precision and intimacy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.