Ohmic contacts to thin film circuits
US4025404A · kind A · utility
8Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1975 |
| Grant date | May 24, 1977 |
| Priority date | — |
| Expiry date | Nov 4, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for establishing gold contact studs on thin film circuits consists in localized sublayer deposition of a platinum-gold alloy followed by subsequent electrolytic gold thickening of the studs. The studs so produced are particularly fit for thermocompression interconnection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.