Electronic cooling chassis
US4027206A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 12, 1975 |
| Grant date | May 31, 1977 |
| Priority date | — |
| Expiry date | Sep 12, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20909
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic apparatus employing components generating substantial amounts of heat to be dissipated, and particularly solid state components, is in the form of a subassembly that includes a heat sink comprised of a plate or block of metal having a high coefficient of heat conductivity, such as aluminum, to which one or more solid state components may be secured and which also mounts heat radiating fins. The subassembly is slidably supportable in a holder by means of ribs on the inner surfaces of the walls of the holder cooperating with notches in the sides of the heat sink plate, and the holder may be made of dielectric material to electrically isolate the heat sink from an apparatus housing and from other heat sink plates when two or more heat sinks are supported in a holder. A circuit board carrying circuitry associated with the solid state components may be secured directly to one or more of the heat sink subassemblies. An alternate form of the present invention utilizes an extruded, thermally conductive heat radiator in thermal communication with a heat sink formed as a plate or block of metal having a high coefficient of heat conductivity. The heat sink plate is utilized for abs…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.