Molded packaging system
US4030267A · kind A · utility
Inventor
Key dates
| Filing date | Oct 16, 1975 |
| Grant date | Jun 21, 1977 |
| Priority date | — |
| Expiry date | Oct 16, 1995 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D81/113
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
An object to be packaged is suspended in an upwardly open mold whose walls are formed with an array of throughgoing perforations and lined with a gas-pervious sheet. A similarly perforated and lined cover is placed over the mold and foamable polyurethane material is poured into the mold through an elastic hose-like conduit connected to a filling aperture on the mold cover. This material expands within the mold completely filling the space around the object and thereby forms a fitted package around the object. The gas-pervious sheet material lining the mold may be a plurality of synthetic-resin panels formed of parallel inner and outer walls spaced apart by parallel webs defining between the inner and outer walls a plurality of parallel passages. These inner and outer walls are formed with throughgoing perforations opening into the passages so that as the synthetic-resin material expands it passes through the perforations on the inner walls only and projects into the passages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.