Curable resin compositions
US4032593A · kind A · utility
15Cited by
3References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 11, 1975 |
| Grant date | Jun 28, 1977 |
| Priority date | — |
| Expiry date | Jul 11, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition which can give cured products of superior impact resistance, superior flexibility, thermal shock resistance, storage stability and adhesiveness, and which comprises PA1 A. either (1) a polyepoxide compound containing at least two 1,2-epoxy groups per molecule or (2) an unsaturated polyester having a molecular weight of 500 to 5,000. PA1 B. a specified aromatic copolyester having a weight average molecular weight of 10,000 to 100,000 and PA1 C. either (1) a curing agent for the polyepoxide compound (A-1) or (2) an ethylenic monomer copolymerizable with the unsaturated polyester (A-2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.