Heat curable organopolysiloxane compositions containing adhesion additives
US4033924A · kind A · utility
17Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1976 |
| Grant date | Jul 5, 1977 |
| Priority date | — |
| Expiry date | Oct 26, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is disclosed heat curable organopolysiloxane compositions which contain adhesion additives which are organosilicon compounds which contain an epoxy functional group and at least one alkyl group or low molecular weight alkenyl group or hydrogen atom bound to silicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.