Shaped bodies and production of semiconductor material
US4034705A · kind A · utility
1Cited by
8References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1975 |
| Grant date | Jul 12, 1977 |
| Priority date | — |
| Expiry date | Apr 21, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B25/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A technique for producing one or more shaped bodies of semiconductor material using the steps of depositing a layer of the semiconductor material from the gas phase onto the outer surface of a heated, hollow carrier body, or onto the mutually remote surfaces of two carrier bodies spaced from one another, and thereafter removing the carrier body or bodies from the layer or layers so formed. Each carrier body is heated indirectly by a heater body located within said hollow carrier body, or between said spaced carrier bodies, and heated to a temperature above the deposition temperature of the semiconductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.