Image forming curable resin compositions
US4035189A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1975 |
| Grant date | Jul 12, 1977 |
| Priority date | — |
| Expiry date | Jul 10, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/12
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resist image, which is excellent in adhesiveness and high in physicochemical strengths, can be obtained by using as a resist material a resin composition having such properties that when it is exposed to actinic rays, a latent image (cure-precursor) is formed therein, and when it is subjected to subsequent heating, only the latent image portion is selectively cured. An example of the above-mentioned resin composition is a latently curable epoxy resin composition composed essentially of (A) an epoxy resin prepolymer and (B) a compound having in the molecule at least two groups represented by the formulas (I) and/or (II), ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are individually a hydrogen atom, an alkyl group or aryl group. Another example of the resin composition is a curable resin composition composed mainly of photopolymerization sensitizers and N-methylolacrylamide derivatives represented by the formula, ##STR2## wherein R is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms; and R' is a hydrogen atom or a methyl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.