Multi-layered substrate for a surface-acoustic-wave device
US4037176A · kind A · utility
33Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1976 |
| Grant date | Jul 19, 1977 |
| Priority date | — |
| Expiry date | Mar 16, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/02574
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
This invention provides a multi-layered substrate for a surface-acoustic-wave device which substrate comprises a piezoelectric layer on a base, the temperature coefficient of a phase velocity of the surface-acoustic-wave in the piezoelectric layer being different from that of the base, the piezoelectric layer having a thickness less than a wavelength of the SAW. This multi-layered substrate can have a large electromechanical coupling and controlled temperature coefficient of the phase velocity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.