Circuit packaging and cooling
US4037270A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 1976 |
| Grant date | Jul 19, 1977 |
| Priority date | — |
| Expiry date | May 24, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board is provided with a plurality of groups of connectors, so disposed and arranged in respect to each other that each group is capable of receiving a chip carrier. A fluid conduit, carrying a coolant, extends through each group so that when the contacts of a chip carrier are assembled to a group of connectors, a circuit chip, having a heat dissipating bar, is in close contact with the conduit. Conductors on each chip make electrical contact to the contacts on the chip carrier. A clip fastener is fastened to the carrier and includes bias means to bias the chip so that electrical connection is established between the chip contacts and the carrier contacts and thermal connection is established between the heat dissipating bar and the conduit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.