Acid copper plating and additive composition therefor
US4038161A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1976 |
| Grant date | Jul 26, 1977 |
| Priority date | — |
| Expiry date | Mar 5, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An acid plating bath and an improved process for electrodepositing level copper coatings are described. The improved copper plating baths and method include a bath soluble organic leveling compound which is obtained by reacting one or more epihalohydrins with one or more nitrogen-containing compounds which may be substituted pyridines, quinolines, isoquinoline or benzimidazole. Particularly improved results are obtained if the acid copper bath also contains, in addition to the leveling agent, a bath-soluble brightening agent and a wetting agent. The presence of the above-described leveling agent in acid copper plating baths produces a lustrous, smooth and level deposit of copper over a wide range of current densities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.