Resin composition containing copolyphenylene ether
US4038343A · kind A · utility
23Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 1975 |
| Grant date | Jul 26, 1977 |
| Priority date | — |
| Expiry date | Oct 17, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/12
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition comprising (A) 5 to 95 parts by weight of a copolyphenylene ether derived from a mixture of 50 to 98 mole% of a 2,6-dialkylphenol and 2 to 50 mole% of a 2,3,6-trialkylphenol and (B) 5 to 95 parts by weight of a styrene resin. The composition has superior thermal resistance and oxidation stability under heat and satisfactory mechanical properties, and retains these desirable properties after heat-aging. The composition is suitable for preparation of molded articles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.