Fluid casting composition containing low expansion glass filler
US4038491A · kind A · utility
5Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1976 |
| Grant date | Jul 26, 1977 |
| Priority date | — |
| Expiry date | Mar 30, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A fluid, filled, resinous casting composition, having a viscosity below about 20,000 cp. at 100.degree. C, is made from liquid resin, resin curing agent, and as high as 85 weight percent of a glassy filler comprising about 50 to about 60 weight percent of SiO.sub.2, about 12 to about 22 weight percent of Al.sub.2 O.sub.3, about 5 to about 15 weight percent of B.sub.2 O.sub.3, about 4 to about 14 weight percent of MgO and about 2.5 to about 12.5 weight percent of CaO.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.