Aluminum base fluxless brazing alloy
US4040822A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 6, 1975 |
| Grant date | Aug 9, 1977 |
| Priority date | — |
| Expiry date | Oct 6, 1995 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/286
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A family of ductile, non-aggressive, low temperature brazing alloys, particularly suitable for brazing and diffusion-welding aluminum alloys, titanium alloys, beryllium alloys, boron-borsic-graphite composite structures to such alloys, diamond bonding and dissimilar metal joints of aluminum, titanium or steels. The family of aluminum base brazing alloys include, by weight, 0.1 to 5% magnesium, 0.1 to 5% rare earth, 4 to 15% silicon and an addition of 1 to 9% tin, 0.3 to 5% copper, 2 to 10% palladium, 1 to 6% gallium, 1 to 8% silver or 0.1 to 0.25% bismuth or strontium, with the balance aluminum. Where the addition is palladium, the silicon content may be 0 to 12%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.