Deposition method
US4040870A · kind A · utility
15Cited by
3References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 19, 1975 |
| Grant date | Aug 9, 1977 |
| Priority date | — |
| Expiry date | Jun 19, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C28/023
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of depositing a hard metal alloy is described wherein a volatile halide of titanium is reduced off the surface of a substrate and then reacted with a volatile halide of boron, carbon or silicon to effect the deposition on a substrate of an intermediate compound of titanium in a liquid phase. The liquid compound on the substrate is then reacted in the presence of hydrogen to produce a hard deposit containing titanium and boron, carbon or silicon. Also described are products which may be produced by the above method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.