Heat pump system with improved heat transfer
US4042012A · kind A · utility
48Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1976 |
| Grant date | Aug 16, 1977 |
| Priority date | — |
| Expiry date | Aug 27, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump for cooling or heating a conditioned space includes an underground heat pipe laid into a hole in the ground back-filled with soil. The heat transfer of the soil is improved by dispersing highly water-absorbent hydrophilic polymeric gel particles soaked with water around the heat pipe. The water-soaked particles preferably are coated with a water-impermeable film. The water may also be entrapped in liquid form in small bags. Also, a water impermeable sheath may be formed around the back-fill soil to minimize evaporation from the particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.