Process for the activation of resinous bodies for adherent metallization
US4042729A · kind A · utility
28Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1975 |
| Grant date | Aug 16, 1977 |
| Priority date | — |
| Expiry date | Jun 18, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/381
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Means to regenerate the composition and a temperature controlled in the range of 20.degree. to 100.degree. C are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.