Molding materials based on polyvinyl chloride and polyphenylene oxide
US4045382A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 1975 |
| Grant date | Aug 30, 1977 |
| Priority date | — |
| Expiry date | Aug 7, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/12
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to thermoplastic molding materials, of high heat distortion point, comprising polyvinyl chloride or copolymers of vinyl chloride with other vinyl compounds, and polyphenylene oxides. The molding materials according to the invention comprises a blend consisting of PA1 A. 30 - 90% by weight of polyvinyl chloride or of copolymers of vinyl chloride with up to about 30% by weight based on the weight of the copolymer of one or more other vinyl compounds which are copolymerizable with vinyl chloride, and PA1 B. about 10 - 70% by weight of a polyphenylene oxide. Particularly preferred molding materials comprise a blend consisting of PA1 A. 30 - 70% by weight of polyvinyl chloride or of its copolymers with up to about 30% by weight based on the weight of the copolymer of copolymerizable vinyl compounds, and PA1 B. about 70 - 30% by weight of a polyphenylene oxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.