Patent · US Expired

Molding materials based on polyvinyl chloride and polyphenylene oxide

US4045382A · kind A · utility

10Cited by
6References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 7, 1975
Grant dateAug 30, 1977
Priority date
Expiry dateAug 7, 1995

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L71/12
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to thermoplastic molding materials, of high heat distortion point, comprising polyvinyl chloride or copolymers of vinyl chloride with other vinyl compounds, and polyphenylene oxides. The molding materials according to the invention comprises a blend consisting of PA1 A. 30 - 90% by weight of polyvinyl chloride or of copolymers of vinyl chloride with up to about 30% by weight based on the weight of the copolymer of one or more other vinyl compounds which are copolymerizable with vinyl chloride, and PA1 B. about 10 - 70% by weight of a polyphenylene oxide. Particularly preferred molding materials comprise a blend consisting of PA1 A. 30 - 70% by weight of polyvinyl chloride or of its copolymers with up to about 30% by weight based on the weight of the copolymer of copolymerizable vinyl compounds, and PA1 B. about 70 - 30% by weight of a polyphenylene oxide.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.