Metallic bonding method
US4046305A · kind A · utility
26Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1975 |
| Grant date | Sep 6, 1977 |
| Priority date | — |
| Expiry date | Oct 28, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12764
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Bonded metallic structures comprising at least two pieces each of a metallic aluminous substance selected from the group consisting of aluminium and aluminium alloys are formed by bonding the pieces together by eutectic diffusion bonding using a metallic interlayer material which is applied between the surfaces to be joined, which forms a less stable oxide than that formed by the aluminous substance and which is preferably selected from the group consisting of copper and copper-rich alloys including at least about 95% copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.