Method for coating a substrate
US4046659A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 1975 |
| Grant date | Sep 6, 1977 |
| Priority date | — |
| Expiry date | Jan 10, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/35
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improved method is described for coating a substrate in a system in which an insulating layer is also formed on one portion of a conductive target plate which is bombarded with ions. One such system is a reactive sputtering system in which a predetermined partial pressure of a reactive gas is established between a reactive metal target plate and the substrate. The bombarding ions are formed in a glow discharge plasma which may be magnetically confined. In accordance with the invention, an ac potential is applied to the target plate in order to prevent arcing which is believed due to the dielectric breakdown of the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.