Composite metal polymer films
US4048349A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1974 |
| Grant date | Sep 13, 1977 |
| Priority date | — |
| Expiry date | Dec 5, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/08
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process is described for producing a composite metal film in which metalliferous particles and polymer particles are co-deposited on a substrate, the proportion of metalliferous particles being such that the metal film is discontinuous, the metal particles being present in the form of islands with intervening zones of polymeric material. The resulting composite films have negative temperature coefficient of resistance. The process may be applied to the production of semiconductor composite films, e.g., copper oxide films by means of an annealing oxidative treatment to convert metal to metal oxide before loss of polymeric matrix by oxidation or evaporation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.