Pressure sensitive hot-melt adhesive system
US4049483A · kind A · utility
46Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1976 |
| Grant date | Sep 20, 1977 |
| Priority date | — |
| Expiry date | Nov 18, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2891
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt adhesive system which has pressure-sensitive adhesive characteristics at room temperature comprising a heat-activatable hot melt adhesive containing therein inherently tacky elastomeric copolymer microspheres.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.