Hardenable moulding compositions containing a thermoplastic polymer a copolymerizable vinyl compound and a polyesterurethane
US4051085A · kind A · utility
6Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1975 |
| Grant date | Sep 27, 1977 |
| Priority date | — |
| Expiry date | Oct 9, 1995 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L75/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Heat-hardenable moulding compositions of: PA1 A. from 3 to 30 parts by weight of a thermoplastic polymer, PA1 B. from 20 to 70 parts by weight of a copolymerizable vinyl compound, and PA1 C. from 20 to 70 parts by weight of a polyesterurethane containing .alpha.,.beta.-unsaturated dicarboxylic acid radicals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.