Semiconductor device having multistepped bump terminal electrodes
US4051508A · kind A · utility
25Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1976 |
| Grant date | Sep 27, 1977 |
| Priority date | — |
| Expiry date | Jun 9, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A terminal electrode for a semiconductor device includes a bump terminal comprising first, second, and third metal layers producing a step-like profile. The bump terminal is characterized by improved mechanical strength for gang bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.