Molding compositions
US4052348A · kind A · utility
3Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 1973 |
| Grant date | Oct 4, 1977 |
| Priority date | — |
| Expiry date | Jan 15, 1993 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/942
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Improved molding compositions especially adapted for fabrication into packaging materials, which compositions comprise an intimate blend of a nitrile polymer and a formaldehyde compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.