Electrodeposition of copper

US4053377A · kind A · utility

Assignee

• The United States of America, as represented by The Secretary of The Interior · US

Inventors

• David Schlain · Greenbelt, US
• Frank X. McCawley · Cheverly, US
• Gerald R. Smith · Farmington, US

Key dates

• Filing date: Feb 13, 1976
• Grant date: Oct 11, 1977
• Expiry date: Feb 13, 1996

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25C7/00
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The invention consists of a method for electrowinning or electrorefining of metals, particularly copper, comprising electrodepositing the metal from an electrolyte solution under conditions comprising high cathode and anode current densities and high velocity flow of electrolyte past the electrode surfaces. Current densities of about 60 to 400 amp/sq ft are employed, with electrolyte flow rates of at least 75 ft/min, preferably about 150 to 400 ft/min.