Thermoplastic additives for molding compounds
US4054561A · kind A · utility
18Cited by
15References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1977 |
| Grant date | Oct 18, 1977 |
| Priority date | — |
| Expiry date | Mar 7, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/12
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic additives comprising the esterification product of a mixture of glycols and oligomers with dimer and trimer acids are blended with thermosetting resins to reduce the shrinkage of the latter on molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.