Index mounting unitary heat sink apparatus with apertured base
US4054901A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1975 |
| Grant date | Oct 18, 1977 |
| Priority date | — |
| Expiry date | Oct 14, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a unitary heat sink apparatus in the form of a U-shaped body of thermally conductive material adapted for use in connection with semiconductor device packages having a thermally conductive transfer plate adjacent one major face of the device package. Typical of such device packages is the TO-220 plastic power package. One leg of the U-shaped clip urges the thermal transfer plate into intimate contact with a flat portion of the opposite leg by the spring action provided by the base of the U. An aperture in the base of the U allows the leads to extend from the heat sink. Fins are included on one leg of the heat sink and means for attaching the heat sink apparatus to printed circuit boards are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.