Method of etching copper and copper alloys
US4058431A · kind A · utility
10Cited by
7References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 20, 1975 |
| Grant date | Nov 15, 1977 |
| Priority date | — |
| Expiry date | Oct 20, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0329
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of etching copper and copper alloys by means of an ammoniacal etching solution containing chloride ions and for regenerating this etching solution during this etching process by adding an ammoniacal compound, for example, in the form of ammonium hydroxide or ammonia gas, as well as hydrochloric acid and water to the etching solution in accordance with continuous measurements of the pH-value and the specific gravity of the etching solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.