Oxygen-free copper product and process
US4059437A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1975 |
| Grant date | Nov 22, 1977 |
| Priority date | — |
| Expiry date | Jul 2, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/026
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved copper product and process of making it, wherein oxygen-free copper contains small amounts of manganese above normal impurity levels, and has enhanced grain size control during annealing, high electrical conductivity, and increased ductility as cast or fabricated. By adding approximately 1 to approximately 100 parts per million of manganese, the desired oxygen-free product has a minimum electrical conductivity of 100% I.A.C.S. By adding approximately 1 to approximately 50 parts per million of manganese, the desired oxygen-free product has a minimum electrical conductivity of 101% I.A.C.S. When at least approximately 30 parts per million of manganese are added to the oxygen-free copper, ductility is maximized. The manganese may be added at any convenient stage of producing the oxygen-free copper. The copper after annealing is free of or less subject to roughened surfaces or cracking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.