Apparatus for bonding layers of resinous material
US4059478A · kind A · utility
Inventor
Key dates
| Filing date | Mar 10, 1976 |
| Grant date | Nov 22, 1977 |
| Priority date | — |
| Expiry date | Mar 10, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/12
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for bonding at least two films of resinous material such as polyester films to one another wherein at least a portion of one surface of one polyester film is placed contiguous with at least a portion of one surface of the other polyester films adjacent thereto. At least one layer of resinous material such as a layer of polyester is placed adjacent each of the other surfaces of the polyester films to be bonded and opposite the contiguous portions of the surfaces. The contiguous portions of the polyester films to be bonded are compressed against one another by pressure applied to the two outermost layers of polyester. The temperature of the contiguous portions along their interface is raised at least to a bonding temperature of the polyester by energy transmitted through the layers of polyester on each side of the two polyester films. When the energy, and subsequently the pressure, are removed from the polyester films, a bond is formed between the contiguous surfaces of the polyester films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.