Glass-moulded type semiconductor device
US4059837A · kind A · utility
9Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1976 |
| Grant date | Nov 22, 1977 |
| Priority date | — |
| Expiry date | Apr 5, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to the present invention comprises a silicon pellet adhesively fixed with a soft solder between a pair of leads provided with headers and having a thermal expansion coefficient greatly different from those of the silicon pellet and mould glass. An assembly including the silicon pellet is then glass-moulded to provide semiconductor device. The leads are provided with a film having low wetness to glass for preventing a breakage of the mould glass due to the difference between the thermal expansion coefficients.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.