Interconnected module
US4059849A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 1974 |
| Grant date | Nov 22, 1977 |
| Priority date | — |
| Expiry date | Dec 16, 1994 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/7076
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Solderable conductive strips bonded to ceramic insulator spacers interconnect terminals of adjacent substrates in a microcircuit module. Input-output connector pins are bonded to a selected base substrate and are electrically connected to the conductive strips which serve as through connecting means. Assembly and disassembly are accomplished by a reflow soldering procedure wherein hot gas is applied to the spacer-substrate interface, thereby minimizing the risk of substrate heat damage. The resulting electrical and mechanical connection is more reliable than the connection established by conventional structures having interconnecting pins since pin alignment stresses are eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.