Bonded composite structures
US4060664A · kind A · utility
15Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1975 |
| Grant date | Nov 29, 1977 |
| Priority date | — |
| Expiry date | Dec 8, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Bonded composite structures having improved bonding materials comprising a thin zone of polycarbodiimide polymer. Methods of preparing the bonded structures are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.