Heat-stable polyimide resins
US4064192A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 25, 1976 |
| Grant date | Dec 20, 1977 |
| Priority date | — |
| Expiry date | Mar 25, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/085
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
New heat-stable resins are provided having good mechanical and electrical properties combined with chemical inertness at temperatures of 200.degree. to 300.degree. C, which resins are resins of a three-dimensional polyimide which is obtained by reacting, at between 50.degree. C and 350.degree. C, a bisimide of the general formula: ##STR1## in which Y denotes H, CH.sub.3 or Cl, and A represents a divalent organic radical possessing at least two carbon atoms, a polyamine of the general formula: EQU R (NH.sub.2).sub.x in which x represents an integer at least equal to 2 and R denotes an organic radical of valency x, and an alazine of the general formula: EQU G -- CH .dbd. N -- N .dbd. CH -- G in which G represents a monovalent aromatic radical, and a polymerizable monomer other than a bis-imide, containing at least one polymerizable vinyl, maleic, allyl or acrylic --CH .dbd. C< group in amounts such that if N.sub.1 represents the number of mols of bis-imide employed, N.sub.2 represents the number of mols of polyamine employed and N.sub.3 represents the number of mols of alazine employed, the ratio ##EQU1## is at least 1.3, x being defined as above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.