Porous metallic layer and formation
US4064914A · kind A · utility
42Cited by
6References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 23, 1976 |
| Grant date | Dec 27, 1977 |
| Priority date | — |
| Expiry date | Nov 23, 1996 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/907
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A metallic porous layer is formed on copper or copper alloy base material by providing a loose coating of copper or steel powder matrix, bonding metal alloy consisting of copper and phosphorous, or copper and antimony and a liquid binder, partially heating to evolve the liquid binder and further heating to 1350.degree.-1550.degree. F. to braze the bonding metal alloy to the base material and matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.