Electrodeposition of palladium
US4066517A · kind A · utility
14Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1976 |
| Grant date | Jan 3, 1978 |
| Priority date | — |
| Expiry date | Mar 11, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/567
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a palladium electroplating bath and a method of plating therewith. The bath contains palladium as the palladosammine chloride and a phosphonic compound which is an alkylene diamine phosphonate derivative. The bath may be employed to plate palladium or its alloys. In a preferred embodiment, a pure palladium deposit may be obtained which exhibits very low porosity even after subsequent cold forming of the article on which it is deposited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.