Method of bonding gold films to non-electrically conducting oxides and product thereby obtained
US4066819A · kind A · utility
6Cited by
5References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1971 |
| Grant date | Jan 3, 1978 |
| Priority date | — |
| Expiry date | Oct 21, 1991 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0237
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microstrip board comprising a gold film which contains about at least 1/2 weight per cent of aluminum bonded to a non-electrical conducting oxide is prepared by simultaneously evaporating the gold and aluminum onto the non-electrical conducting oxide and thereafter optionally heating the film thus formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.