Anti-vibration heat-insulation structure and a process for production thereof
US4069284A · kind A · utility
5Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1973 |
| Grant date | Jan 17, 1978 |
| Priority date | — |
| Expiry date | Jan 22, 1993 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249969
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
The present invention relates to an anti-vibration heat-insulation structure and a process for the production thereof characterized by filling the void in the structure to form a heat-insulation layer with silicic acid bonding agent-coated silicic acid mineral grains which swell in volume when fired at a high temperature; and then heating and thereby expanding these silicic acid mineral grains and at the same time allowing said grains to stick to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.