High heat dissipation mounting for solid state devices and circuits
US4069497A · kind A · utility
53Cited by
5References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 13, 1975 |
| Grant date | Jan 17, 1978 |
| Priority date | — |
| Expiry date | Aug 13, 1995 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solid state device or circuit mounted or printed on a heat conductive ceramic substrate such as beryllia is brought into thermal conductive relation with a metal heat dissipation plate as by clamping with no intervening materials such as an adhesive or solder therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.