Method for applying contained pattern composition for soldering
US4070506A · kind A · utility
1Cited by
3References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 22, 1976 |
| Grant date | Jan 24, 1978 |
| Priority date | — |
| Expiry date | Nov 22, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0786
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for applying a contained pattern to prevent solder overrun by applying a composition which can be applied in liquid form to a work surface where it dries, and subsequent soldering on said work surface will be substantially limited to the pattern laid down by the composition so that there is no solder overrun. The composition also has useful fire retardant properties which protects the underlying work surface. Such composition is a mixture of magnesium hydroxide, water and mica in the laminated silica mineral form.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.