Poly(higher-1-olefin/1-butene) copolymers as hot-melt pressure-sensitive adhesives
US4072813A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1976 |
| Grant date | Feb 7, 1978 |
| Priority date | — |
| Expiry date | Feb 11, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2423/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention relates to single component, hot-melt, pressure-sensitive adhesives based on 1-butene/higher 1-olefin copolymers or 1-butene/propylene/higher 1-olefin copolymers containing 40-60 mole % of at least one higher 1-olefin. Suitable higher 1-olefins include 1-hexene through 1-decene. These new adhesives can be readily applied to substrates such as tape by means of conventional hot-melt coating equipment and thereby eliminate the solvent pollution problems associated with the application of current solvent-based pressure-sensitive adhesives. Our hot-melt coated tapes generally have pressure-sensitive adhesive properties at least equivalent to those of solvent coated pressure-sensitive tapes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.