Integrated circuit package
US4072816A · kind A · utility
52Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1976 |
| Grant date | Feb 7, 1978 |
| Priority date | — |
| Expiry date | Dec 13, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A prepunched copper/dielectric laminate ground plane assembly is positioned on a metallized ceramic substrate having printed circuits on the surface thereof and provided with a plurality of circuit connection pins. Connection between the ground plane and the circuit connection pins is achieved by welding or soldering of bonding elements between selected pins, which also provides mechanical attachment of the ground plane to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.