Composition for the activation of resinous bodies for adherent metallization
US4073740A · kind A · utility
20Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 1977 |
| Grant date | Feb 14, 1978 |
| Priority date | — |
| Expiry date | Feb 28, 1997 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/381
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Means to regenerate the composition and a temperature controlled in the range of 20.degree. C. to 100.degree. C. are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.