Gold plating bath and process
US4075065A · kind A · utility
7Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1976 |
| Grant date | Feb 21, 1978 |
| Priority date | — |
| Expiry date | Jun 18, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/48
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrolyte for depositing gold on a surface includes an alkali gold cyanide, a weak Lewis acid, a weak polyfunctional water-soluble aliphatic acid, a non-depositing metallic compound, a metallic hardener, and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.