Electroplating zinc, ammonia-free acid zinc plating bath therefor and additive composition therefor
US4075066A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1977 |
| Grant date | Feb 21, 1978 |
| Priority date | — |
| Expiry date | Jan 27, 1997 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides an ammonia-free acid zinc plating bath for electrodepositing bright zinc on a substrate in which the zinc deposit produced thereby is ductile and presents a glossy to bright coating on the substrate over a wide cathodic current density range. The ammonia-free acid zinc plating baths of the invention comprise zinc ions, chloride ions, at least one polyoxyalkylated naphthol, at least one aromatic carboxylic acid or bath-soluble salt thereof, and at least one anionic aromatic sulfonic acid or bath-soluble salt thereof. In addition to the above components, the ammonia-free acid zinc plating baths of the invention may contain at least one nonionic polyoxyethylene compound and at least one aromatic aldehyde, ketone, or mixtures thereof. The ammonia-free acid zinc plating baths of the invention are free from significant amounts of complexing agents that would impede the removal of zinc ions from the baths prior to disposal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.