Molding compounds
US4075155A · kind A · utility
10Cited by
2References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 1976 |
| Grant date | Feb 21, 1978 |
| Priority date | — |
| Expiry date | Dec 17, 1996 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
I have developed sheet molding compounds comprising aldehyde condensate thermosetting resins and inorganic fillers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.