Electronic thin film circuit unit and method of making the same

US4075416A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Klaus Kuttner · Stuttgart, DE
• Gunter Kruger
• Fedor Modic · Leonberg, DE

Key dates

• Filing date: Jan 27, 1976
• Grant date: Feb 21, 1978
• Expiry date: Jan 27, 1996

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D86/85

Abstract

After a valve metal layer on an insulating substrate has been metallized by sputtering on two layers of copper separated by an intermediate layer of iron, nickel or cobalt, and the combined circuit and component pattern has been etched out, followed by selectively etching away the metallization over the resistance components of the circuit, electroless deposited nickel and gold layers are successively applied to the remaining metallization and a solder layer is then applied on top by contact with liquid solder.