Electrical circuit element comprising thick film resistor bonded to conductor
US4076894A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1975 |
| Grant date | Feb 28, 1978 |
| Priority date | — |
| Expiry date | Oct 28, 1995 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Thick film resistive elements are prepared from an intimate admixture comprising silica, lead oxide and ruthenium dioxide or iridium dioxide which is heated to a temperature sufficient to provide a lead-containing glass having dispersed therein lead ruthenate or lead iridate. The lead-containing glass is comminuted and a resistor paste is formed which can be subsequently coated and fired on to a desired substrate to form the thick film resistive component. The method of this invention may facilitate the production of thick film resistors exhibiting a low temperature coefficient of resistivity, relative freedom from noise and drift, and high moisture resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.