Process for the accomplishment of deep microengraving by a laser beam
US4078164A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1976 |
| Grant date | Mar 7, 1978 |
| Priority date | — |
| Expiry date | Jan 9, 1996 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/0661
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for deep micro-engraving of a material includes the steps of superpositioning a plurality of elementary layers of respectively alternating indices on the material. Each of the layers is individually transparent to a predetermined wavelength in vacuum, and has an optical thickness equal to one quarter of the predetermined wavelength. The process further includes forming a plurality of openings in the elementary layers; the openings correspond to regions to be engraved on the material, and uncover selected portions of the material. The material is then illuminated by a laser beam of sufficient power to engrave, by sublimation, the uncovered material portions. The laser has the predetermined wavelength, and the plurality of layers form a mirror for the laser beam, which have a relatively high threshold of damage from the laser, and absorb substantially no power from the laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.